HiEFFICIENT

Final Project Video

HiEFFICIENT NEWS 2024/11/20

Newsletters 2024/11/20

31 partners from semiconductor industry, suplliers, automotive manufacturers, research organizations and universities tightly cooporated to fulfill the following objectives:

- the integration of wide-bandgap power electronics from component to sytem level,

- the reduction of losses, and

- an increase in lifetime and reliability.

In this video you can explore the advancements reached in this funded Chips JU project.

Enjoy watching!

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Highly EFFICIENT and reliable electric drivetrains based on modular, intelligent, and highly integrated wide bandgap power electronics modules.

This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement no. 101007281. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Austria, Germany, Slovenia, Netherlands, Belgium, Slovakia, France, Italy, and Turkey.

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