Scientific publications
HiEFFICIENT PUBLiCATiONS
  1. Dini, P., & Saponara, S. (2021). Electro-thermal model-based design of bidirectional on-board chargers in hybrid and full electric vehicles. Electronics, 11(1), 112. 
    https://www.mdpi.com/2079-9292/11/1/112

  2. Hepp, M., Hertenstein, L., Nisch, A., Wondrak, W., Bertele, F., & Heller, M. (2022, May). Potential of GaN Semiconductors in Electric Vehicle Inverters. In PCIM Europe 2022; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 1-8). VDE.
    https://ieeexplore.ieee.org/abstract/document/9862159

  3. Di Nuzzo, G., Tuellmann, M., Methfessel, T., & Rzepka, S. (2022). Condition monitoring indicators for Si and SiC power modules. Microelectronics Reliability, 138, 114614.
    https://www.sciencedirect.com/science/article/pii/S002627142200138X

  4. Kosesoy, Y., Bonten, R., Huisman, H., & Schellekens, J. (2022, September). Control of a Zero-Voltage Switching Isolated Series-Resonant Power Circuit for Direct 3-phase AC to DC Conversion. In 2022 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe) (pp. 01-07). IEEE.
    https://ieeexplore.ieee.org/abstract/document/9907481

  5. Pradhan, A., Moldaschl, T., Hasan, M. N., Schicker, J., Binder, A., & De Doncke, R. W. (2023, May). Design and Multiphysics Simulation of a PCB-Embedded-Package Enclosing a Gallium Nitride System on Chip Grown on a Novel Substrate. In PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 1-5). VDE.
    https://ieeexplore.ieee.org/abstract/document/10173384

  6. Verbrugge, B., Rauf, A. M., Rasool, H., Abdel-Monem, M., Geury, T., El Baghdadi, M., & Hegazy, O. (2022). Real-Time Charging Scheduling and Optimization of Electric Buses in a Depot. Energies, 15(14), 5023.
    https://www.mdpi.com/1996-1073/15/14/5023

  7. Di Nuzzo, G., Lewitschnig, H., Tuellmann, M., Rzepka, S., & Otto, A. (2023, June). A Data-driven Condition Monitoring method to predict the Remaining Useful Life of SiC Power Modules for Traction Inverters. In 2023 IEEE International Conference on Prognostics and Health Management (ICPHM) (pp. 312-319). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10194131

  8. Choo, V. L., & Pfost, M. (2023, May). A Variable Gate Resistance SiC MOSFET Driver Network to Mitigate Overshoot and Parasitic Ringing. In PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 1-7). VDE.
    https://ieeexplore.ieee.org/abstract/document/10173251

  9. Hosseinabadi, F., Jaman, S., Bhoi, S. K., Hasan, M. M., Chakraborty, S., El Baghdadi, M., & Hegazy, O. (2022, September). Implementation of onsite Junction Temperature Estimation for a SiC MOSFET Module for Condition Monitoring. In 2022 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe) (pp. P-1). IEEE.
    https://ieeexplore.ieee.org/abstract/document/9907607

  10. Hosseinabadi, F., Polat, H., Martin, G. E., Bhoi, S. K., Chakraborty, S., Geury, T., ... & Hegazy, O. (2022, October). Active Thermal Control of a WBG-based AC-DC Converter Using Dynamic Gate-drive for Lifetime Improvement. In IECON 2022–48th Annual Conference of the IEEE Industrial Electronics Society (pp. 1-6). IEEE.
    https://ieeexplore.ieee.org/abstract/document/9968793

  11. Bay, O., Hosseinabadi, F., Chakraborty, S., El Baghdadi, M., & Hegazy, O. (2022, October). Multi-Objective Optimization of Bi-directional On-Board Chargers Based on 650V GaN Power Transistors. In IECON 2022–48th Annual Conference of the IEEE Industrial Electronics Society (pp. 1-6). IEEE.
    https://ieeexplore.ieee.org/abstract/document/9968522

  12. Polat, H., Hosseinabadi, F., Hasan, M. M., Chakraborty, S., Geury, T., El Baghdadi, M., ... & Hegazy, O. (2023). A Review of DC Fast Chargers with BESS for Electric Vehicles: Topology, Battery, Reliability Oriented Control and Cooling Perspectives. Batteries, 9(2), 121.
    https://www.mdpi.com/2313-0105/9/2/121

  13. Bay, O., Tran, M. T., El Baghdadi, M., Chakraborty, S., & Hegazy, O. (2023). A Comprehensive Review of GaN-Based Bi-directional On-Board Charger Topologies and Modulation Methods. Energies, 16(8), 3433.
    https://www.mdpi.com/1996-1073/16/8/3433

  14. Albrecht, J., & Rzepka, S. (2022, December). Physics of Degradation based Surrogate Model using Deep Learning for Lifetime Prognostics of Solder Joints in Microelectronics. In 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (pp. 759-762). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10013265

  15. Tranchero, M., & Santero, P. (2023, May). Comparison of AC Common-Mode Filter Topologies through SPICE Simulations. In PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 1-6). VDE.
    https://ieeexplore.ieee.org/abstract/document/10173364

  16. Tranchero, M., & Santero, P. (2023, May). Thermal Considerations for Y Capacitors in Wide Band-Gap Based Inverters. In PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 1-6). VDE.
    https://ieeexplore.ieee.org/abstract/document/10173444

  17. Stok, E., Otten, M., Huisman, H., & Kösesoy, Y. (2023, September). EMI Reduction in an Interleaved Buck Converter Through Spread Spectrum Frequency Modulation. In 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (pp. 1-11). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10264338/

  18. Azhar, U., Aghdaei, A., & De Doncker, R. W. (2023, September). Optimization of Temperature Sensor Placement in Multi-Chip Power Modules Using Frequency Domain Analysis. In 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (pp. 1-7). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10264390

  19. Marek, J., Kozarik, J., Minarik, M., Chvála, A., Matus, M., Donoval, M., ... & Weis, M. (2022). Charge Trap States of SiC Power TrenchMOS Transistor under Repetitive Unclamped Inductive Switching Stress. Materials, 15(22), 8230.
    https://www.mdpi.com/1996-1944/15/22/8230

  20. Martin, G. E., Hosseinabadi, F., Chakraborty, S., El Baghdadi, M., Romano, C., Tranchero, M., & Hegazy, O. (2023, September). Comparative Thermal Analysis of Cooling Methods for Dual Inverter Applications in Electric Vehicles. In 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (pp. 1-6). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10264584

  21. Polat, H., Martin, G. E., Tran, T. M., Geury, T., El Baghdadi, M., & Hegazy, O. (2023, September). 30 kW Three-Phase T-Type Active Front End 3D Electro-thermal Design. In 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (pp. P-1). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10264235/

  22. Hosseinabadi, F., Bay, O., Bhoi, S. K., Chakraborty, S., El Baghdadi, M., & Hegazy, O. (2023, September). Active Thermal Control of a DC-DC Converter Using Dynamic Gate-drive for Reliability Improvement. In 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (pp. 1-8). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10264268

  23. Bhoi, S. K., Frikha, M. A., Martin, G. E., Hosseinabadi, F., Chakraborty, S., El Baghdadi, M., & Hegazy, O. (2023, September). A Data-Driven Thermal Digital Twin of a 3-Phase Inverter Using Hi-Fidelity Multi-Physics Modelling. In 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (pp. 1-8). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10264373

  24. Marek, J., Minárik, M., Matúš, M., Kozárik, J., & Stuchlíková, Ľ. (2023, September). SiC Power TrenchMOS Transistor under harsh repetitive switching conditions. In 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) (pp. 1-8). IEEE.
    https://ieeexplore.ieee.org/abstract/document/10264402/