HiEFFICIENT

D2.1. Feasibility study for integration technologies at high volume/low cost

HiEFFICIENT NEWS 2022/11/08

Public deliverables 2022/11/08

Executive Summary

This report presents a technological review of the current and advanced future packaging technologies for embedded power modules. Especially Wide Bandgap SiC and GaN semiconductors are addressed by the very low inductance and outstanding cooling performance. Numerous new packaging concepts were discussed as part of a joint innovation workshop.

Public deliverables D1.4 Initial Project Metrics

Based on the requirements defined in Task 1.2.1 the UCs will be measured against the set project obj ...

Public deliverables D4.1 Assessment of cooling concepts for HiEFFICIENT Use Cases

With respect to work package 4, the advanced cooling concepts for highly integrated power electronic ...

Public deliverables D1.1 Specification of Use Cases

In this document, for each use case, the objectives, the main targets, the functionality, the testin ...

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Highly EFFICIENT and reliable electric drivetrains based on modular, intelligent, and highly integrated wide bandgap power electronics modules.

This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement no. 101007281. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Austria, Germany, Slovenia, Netherlands, Belgium, Slovakia, France, Italy, and Turkey.

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